看了晶圆兆声单面刷洗甩干机的用户又看了
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适用工件: (Applicable parts) | 6寸/8寸蓝宝石或碳化硅 6"/8“Sapphire or SiC Wafer |
批量产能: (Capacity) | 60s/pcs |
工艺流程: (Procedure Flow) | 上料→ 晶圆定位→旋转刷洗及二流体喷洗(硅面)→翻转180度→旋转刷洗、兆声波喷洗(碳面)→旋转甩干→下料 Load→Location→Rotation,brushing,cleaning,two-fluid spraying(Si side)→Turn over 180 degree→Rotation, brushing,cleaning,megasonic spraying(C side)→Rotation, Spin-Drying→Unload |
主要材料: (Major Material) | 金属骨架+PP瓷白壳板 Metal Frame+PP white board |
运送方式: (Transportation) | 通过洁净机械手进行晶圆传输 Wafer transported by clean robotic hand |
工艺效果: (Process effect) | a.particle size0.3~0.5um,remove %>90%or <200e.a; b.particle size0.5~1um,remove%>95%or <10e.a。 PS:inspection machine is for Candela or SICA |
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