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ST115G
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Remarks:
1. All the typical value is based onthe 1.0mm specimen, while the Tg is for specimen≥0.50mm.
2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.
3. UL certificated Single/Double sidePCB min. thickness 0.38mm.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Thermal Conductivity | ASTM-D5470 | A | W/ (m•K) | 1.6 |
| ASTM E1461 | A | 2.0 | ||
| Tg | 2.4.25D | DSC | ℃ | 170 |
| Td | 2.4.24.6 | Wt 5% loss | ℃ | 410 |
| Thermal Stress | 2.4.13.1 | 288℃, solder float | min | >30 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 37 |
| After Tg | ppm/℃ | 166 | ||
| 50-260℃ | % | 2.2 | ||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ/cm | 108 |
| Surface Resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 107 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.05 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.11 |
| CTI | IEC60112 | A | Rating | PLC0 |
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