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LM500是台式自动磨片研磨机,用于将薄片压平,并将样品厚度的减薄磨平。这台设备十分强大,可同时处理多达6个芯片或24个薄片。成品表面光洁度极高,可以去除切割和磨削引起的亚表面损伤,并达到所需的试样厚度和均匀度。该装置主要由旋转开槽的铸铁板,研磨夹具,精密薄片研磨夹具,研磨厚度调节组件,平整校正轮缘,磨料液分配和回收系统组成。操作员可以通过控制面板手动控制设备或以自动模式运行设备。
重量:250公斤
尺寸:700x700x1,400毫米
电源:220VAC,50/60Hz
研磨盘直径:500毫米
研磨盘转速:20-75转/分钟
适用样品尺寸:30x45毫米(1x 1.5英寸),
60x45毫米(1x3英寸)的薄片
低速时也无振动
易于快速清洁
全自动操作
采样率高
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The LM 500 is a bench floor single-plate lapping machine, utilized to flatten the chip face which will be glued to a slide and to perform the final thin section sample thickness reduction. The powerful apparatus can simultaneously process up to 6 chips or 24 thin sections, with an exceptionally high degree of surface finish. By removing subsurface damage caused by sawing and grinding, the desired specimen thickness and evenness are achieved. The device is mainly composed of a rotating grooved cast iron plate, a chip lapping jig, a precision thin section lapping jig, a lapping thickness tuning tool, an unevenness correction rim and an abrasive fluid (e.g. silicon carbide) dispensing and recycling system. Via a control panel, the operator can manually control the apparatus or run it in the automatic mode. Specimen size: Plate diameter: Weight: Power supply: * |
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