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SAR20H
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型号:
无卤,高CTI,胶膜型铝基覆铜板
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江苏
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Remarks:

1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.

2. All  the typical values listed above are for your reference only and not  intended for specification. Please contact Shengyi Technology Co., Ltd.  for detailed information. All rights from this data sheet are reserved  by Shengyi Technology Co., Ltd.  

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning  

The first digit following the letter indicates the  duration of preconditioning in hours, the second digit the  preconditioning temperature in ℃ and the third digit the relative humidity.

ItemsMethodConditionUnitTypical Value
Thermal ConductivityASTM-D5470AW/ (m•K) 2.1
Thermal ResistanceASTM-D5470AK·cm2/W  0.52
Tg2.4.25DDSC160
Td
2.4.24.6Wt 5% loss395
Thermal Stress2.4.13.1288℃, solder floatmin
30
CTE (Z-axis)2.4.24Before Tgppm/℃17
After Tgppm/℃39
50-260℃%0.69
Volume Resistivity2.5.17.1C-96/35/90MΩ.cm108  
Surface Resistivity
2.5.17.1
C-96/35/90108  
Dielectric Breakdown2.5.6D-48/50+D-0.5/23kV5.0
Hi-pot TestCPCA4105-2012DCV4000
ACV3000
Peel Strength (1oz)2.4.8288℃/10sN/mm1.3
Flammability
UL94
C-48/23/50
Rating
V-0
MOTULA130
CTIIEC60112ARatingPLC0




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