生益科技
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SI10U
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封装基板用高性能基板材料
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江苏
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Remarks:

1. These properties were measured with 0.80mm laminates except for XY-CTE that was measured with 0.10mm laminates.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

ItemsConditionUnitSI10USI10U LC
TgDMA270270
Td5% wt. loss
>400>400
T300
TMAmin>60>60
CTE (X/Y-axis)Before Tgppm/℃
107
Dissipation Constant (1GHz)2.5.5.9-4.64.2
Dissipation Factor (1GHz)
2.5.5.9-0.0060.006
Peel Strength12 um LPN/mm
0.80.8
Flexural ModulusAGPa
3032
Water AbsorptionC-168/85/85%
0.350.35
Flammability
UL-94Rating
V-0V-0
Heat Resistance300℃/solder dips
>300>300
Heat Resistance after Moisture absorption
PCT 5h+288℃solder 20s
-Pass Pass
Halogen free
--Yes
Yes
Glass
--E glassLow CTE-glass




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