团簇式多腔体真空系统(星型)用于多层膜结构的沉积和生长，可以消除交叉污染，有利于高品质电学器件的制备。

Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each module as described below is controlled independently allowing simultaneous deposition in all chambers.

真空水平 Vacuum:Ultra-high vacuum (UHV).

基底尺寸 Substrate size:10cmx10cm or 15.6cmx15.6cm.

功能模块 Modules:

• PECVD: RF， VHF and pulsed (modulated) RF plasma.

• HWCVD.

• Sputtering (ITO， AZO， metals， etc) with oscillation.

• Laser crystallization.

• Rapid thermal annealing.

• Park station with heating capability

• Isolation and Transfer Zone (ITZ) with robotic arm (8 or 10 port locations)

• Load lock with the following options:

• single substrate capability.

• connection to glove box.

• multi-substrate capability.

• In-situ characterization module

系统控制 Control:Computer controlled with easy to use HMI and optional data logging.

系统保证 Systems guarantees are defined in the contract and include*:

• Base pressure on each chamber

• Temperature calibration

• Uniformity and opto-electronic properties for each material defined in the contract

• Functionality of all systems

* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)